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个人信息Personal Information
副教授
硕士生导师
性别：男
出生日期：1965-06-03
毕业院校：大连理工大学
学位：博士
所在单位：材料科学与工程学院
学科：材料无损检测与评价
办公地点：大连理工大学材料馆230房间
联系方式：0411-84707117
电子邮箱：chenjun@dlut.edu.cn
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- [1]姚金冶, 郭世浩, 王立, 赏敏, 陈祥序, 马浩然, 王云鹏, 陈军, 马海涛.First-Principles Study of Ni Additions on Mechanical Properties of Η'-Cu6sn5-Based Intermetallic...[J],SSRN,2024
- [2]Chen, Fei, 高楠, 董冲, He, Jingjing, Wang, Chen, Minghui, 王云鹏, 陈军.High-performance catalytic electrode for glucose sensor fabricated by one-step selective oxidatio...[J],MICROCHEMICAL JOURNAL,2024,192
- [3]戚琳, 陈军, 侯英华, 曹志强, 陈国清.思政和工程实践能力同步提升的材料力学性能课程建设[J],中国冶金教育,2024,03:42-45
- [4]朱家乐, 魏香云, 陈军, 卢伟, Shi, Yu, 杨建华.Automatic Recognition of Steel Deterioration Grade By CNN[A],2023 6th International Conference on Electronics Technology, ICET 2023,2024,1176-1181
- [5]陈军, 王帅夫, 李伟, 司立坤, 马海涛, 郝胜智.强流脉冲电子束 M2 高速钢表面改性组织和耐磨性能[J],Surface Technology,2024,52(4):147-154
- [6]Wang, Li, 黄耀萱, 郭世浩, 姚金冶, 邢警, 马海涛, 王云鹏, 陈军.Effect of Different Concentrations of Co Doping on the Properties of η′-Cu6Sn5 and Ni3Sn4: Firs...[J],PHYSICA STATUS SOLIDI B-BASIC SOLID STATE PHYSICS,2024
- [7]Shan, Dan, Wang, Li, 卢伟, 陈军.Convex Optimization Based High-Order Fuzzy Cognitive Map Modeling and Its Application in Time Ser...[J],IEEE Access,2024,12:12683-12698
- [8]陈军, 吴迪, 戚琳, 于迎昕, 侯英华.拓展案例教学 强化课程思政——材料力学性能课程思政改革探索与实践[J],中国教育技术装备,2023,18:78-80
- [9]金士杰, He, X. C., 陈军, Shi, S. Q., 林莉.Recurrence quantitative analysis for porosity characterization of CFRP with complex void morpho...[J],COMPOSITE STRUCTURES,2022,229
- [10]Ding, S. S., 金士杰, 罗忠兵, 陈军, 林莉.Researches on the Ultrasonic Scattering Attenuation of Carbon Fibre Reinforced Plastics with 2D...[J],ACOUSTICAL PHYSICS,2022,63(4):490-495
- [11]朱江, 杨睿, Wang, J.-P., 王雄, Lattery, D.M., 陈军, 张东, Gu, X., Park, H., 唐达, 李铭, 杜欣.Revealing the anisotropic thermal conductivity using time-resolved magneto-optical Kerr effect[A],International Heat Transfer Conference,2022,2018-August:2575-2582
- [12]ANIL KUNWAR, Guo, Bingfeng, Shang, Shengyan, Raback, Peter, 王云鹏, 陈军, 马海涛, 宋学官, 赵宁.Roles of interfacial heat transfer and relative solder height on segregated growth behavior of ...[J],INTERMETALLICS,2022,93:186-196
- [13]Guo, Bingfeng, Jiang, Chengrong, ANIL KUNWAR, 赵宁, 陈军, 王云鹏, 马海涛.Effect of Ag concentration on the Cu6Sn5 growth in Sn-based solder/Cu joints at the isothermal ...[A],2017 18TH INTERNATIONAL CONFERENCE ON ELECTRONIC PACKAGING TECHNOLOGY (ICEPT),2022,1087-1091
- [14]霍军周, Wu H., 陈军.Dynamics simulation of stirling engine for solar energy based on the time-varying support stiffne...[J],Open Mechanical Engineering Journal,2022,8(1):710-715
- [15]吕兴军, 陈军, 李响, 段玉平, Liu, Z..Effects of temperature and time on microstructure and microwave electromagnetic properties of N...[J],MATERIALS TECHNOLOGY,2022,29(3):159-166
- [16]Peng, Wenhai, 郝胜智, Zhao, Limin, 陈军, 李伟.Formation mechanism of graphite nanospheres in W-C-Co system under high current pulsed electron...[J],MATERIALS LETTERS,2022,244:207-210
- [17]马浩然, 王云鹏, 陈军, ANIL KUNWAR, 马海涛, 赵宁.Geometrical outline evolution and size-inhibiting interaction of interfacial solder bubbles and...[J],真空,2022,145:103-111
- [18]ANIL KUNWAR, Shang, Shengyan, Raback, Peter, 王云鹏, Givernaud, Julien, 陈军, 马海涛, 宋学官, 赵宁.Heat and mass transfer effects of laser soldering on growth behavior of interfacial intermetall...[J],MICROELECTRONICS AND RELIABILITY,2022,80:55-67
- [19]Guo, Bingfeng, Jiang, Chengrong, ANIL KUNWAR, 陈军, 赵宁, 王云鹏, 马海涛.In situ study the effects of Cu addition on the rapidly growth of Cu6Sn5 at the Sn-base solder/...[A],2017 18TH INTERNATIONAL CONFERENCE ON ELECTRONIC PACKAGING TECHNOLOGY (ICEPT),2022,974-979
- [20]金士杰, 罗忠兵, 陈军, 林莉.Investigations on relationship between porosity and ultrasonic attenuation coefficient in CFRP la...[A],7th International Symposium on NDT in Aerospace,2022